Fracture Putty

Post Date

August 13th 2008

Application Due Date

June 4th 2009

Funding Opportunity Number

DARPA-BAA-08-50

CFDA Number(s)

12.910

Funding Instrument Type(s)

Cooperative Agreement
Grant
Other

Funding Activity Categories

Science and Technology and other Research and Development

Eligibility Categories

Unrestricted

Funding

• Award Range:

  $None - $None

Grant Description

DARPA seeks to develop a dynamic putty which, when packed in/around a compound bone fracture, provides full load-bearing capabilities within hours, creates an osteoconductive bone-like internal structure, and degrades over time to harmless resorbable by-products as normal bone regenerates. "See Attached Broad Agency Announcement (BAA)"

Contact Information

• Agency

  Department of Defense

• Office:

  Defense Advanced Research Projects Agency

• Agency Contact:

  Mitchell Zakin

• Agency Mailing Address:

  BAA COORDINATOR

• Agency Email Address:

  BAA08-50@DARPA.MIL

• Location:

  DARPA - Defense Sciences Office